| 分析点 / 参数 | 分析物 | 测量范围 | 适合分析仪 |
|---|---|---|---|
| 漂白剂 bleaching agent; 反应器废气 generator product gas; 气体洗涤器尾气 tail gas from generator vent gas scrubber |
过氧化氢 H2O2 | 0-5% wt | OMA 过程分析仪 |
推荐使用： OMA 过程分析仪
CMP is used in fabs to polish the surface of silicon wafers and remove imperfections as layers of circuitry are deposited. Small drift in the composition of CMP slurries can lead to defectivity, raise cost-of-ownership, and cause micro-scratches or corrosion.
A major aspect of maintaining CMP slurry health is keeping the concentration of the oxidizer (often H2O2) constant as per specification in the slurry/oxidizer blend. As chipmakers continue to squeeze in more transistors, more layers of circuitry must be smoothed by CMP—leaving more to be gained from slurry health analysis. Delivery method, filtration type, and replenishment cycle are all significant causes for slurry degradation.